1. PCN No.: QPCN120122. Subject: TS34063 series wafer re-layout
3. To: All customers involved
4. Issued by: Owen Wang
5. Issue date: 12-Jul-2012
6. Proposed first ship date for change: 12-Oct-2012
7. Affected Product Identification: TS34063 series (part no.: TS34063CD C3, TS34063CS RL)
8. Change Description: (OLD Vs. NEW Comparison)
| Old: |
New: |
| Die size: 1.8 mm x 1.7 mm | Die size: 0.93 mm x 0.73 mm |
| Old layout | New layout |
9. Reason for Change: Die optimization.
10. Anticipated Impact: (form, fit, function, quality or reliability)
- Product outline: No change
- Inner construction changed: Die size changed
- Electrical specifications: No change
- Reliability performance: Please see Appendix A – pass reliability test
- Data sheet: No change
- Packing code (order code): No change
11. Qualification plan/result:
Refer to
PPAP Available on demand
Comparison report Available on demand
12. Sample availability Date: Please contact your regional Taiwan
Semiconductor Sales office
13. Tentative implementation date: 12-Jul-2012
14. Remarks: The device circuit of new die is the same as old die. It’s just re-layout for smaller die size.
15. Customer feedback required latest: (should we receive no feedback; the change will be deemed as accepted!) 12-Aug-2012.
Weiterführende Informationen: PCN: TSC QPCN12012 TS34063 series wafer re-layout